In the emerging and rapidly developing field of semiconductor lighting, laser marking technology is becoming a key force driving the progress of the industry with its unique advantages.
From the production process perspective, laser marking plays an important role in the chip - manufacturing stage. Semiconductor lighting chips are extremely small in size and have extremely high precision requirements. Laser marking can accurately mark key information such as model numbers, batches, and production times on the chip surface. The width of the marking lines can reach the micron or even sub - micron level, meeting the strict requirements for high - precision identification in chip manufacturing. Moreover, the non - contact processing characteristic of laser marking avoids the physical damage that traditional contact - type marking may cause to the chip, ensuring the performance and yield rate of the chip.
In the packaging stage, laser marking is also indispensable. Through laser marking, product specifications, luminous parameters, brand logos, and other information can be clearly marked on the packaging shell, which not only facilitates product identification and sales but also effectively enhances the brand image. At the same time, laser marking can also be used to create special textures or patterns on the packaging materials to optimize the light - emission effect and improve the luminous efficiency and uniformity of the lamps.
With the continuous innovation of semiconductor lighting technology, laser marking technology is also constantly evolving. For example, in order to meet the ultra - fine processing requirements of new display technologies such as Mini LED and Micro LED, researchers are exploring laser marking equipment with shorter pulse widths and higher energy densities to achieve higher - precision chip marking and packaging processing. In addition, intelligent laser marking systems are gradually emerging. Through integration with automated production lines, full - automated control of the production process has been achieved, greatly improving production efficiency and the stability of product quality.